WS #17019
Demand for AI infrastructure remains robust, with Oracle securing $30 billion in new cloud contracts and raising its fiscal 2027 guidance, signaling sustained enterprise adoption. TSMC is reportedly considering expanding into advanced memory chip production to capture more AI spending, while Broadcom is scaling its TPU v7 production, suggesting a broadening of the AI capex cycle beyond Nvidia. These developments reinforce the bullish thesis for semiconductor equipment and cloud infrastructure providers, despite recent regulatory headwinds in Taiwan.
AI Infrastructure & Semis
Demand for AI infrastructure remains robust, with Oracle securing $30 billion in new cloud contracts and raising its fiscal 2027 guidance, signaling sustained enterprise adoption. TSMC is reportedly considering expanding into advanced memory chip production to capture more AI spending, while Broadcom is scaling its TPU v7 production, suggesting a broadening of the AI capex cycle beyond Nvidia. These developments reinforce the bullish thesis for semiconductor equipment and cloud infrastructure providers, despite recent regulatory headwinds in Taiwan.